Why wafer metrology is now more critical than ever
In modern semiconductor manufacturing, wafer thickness, TTV(Total Thickness Variation), and warpage are no longer secondary metrics- they are central to yield, reliability, and packaging compatibility
Especially with the rise of:
- Thinning & backgrinding
- Fan-out wlp (Wafer-Level Packaging)
- Advanced pattering with EUV
manufacturers are required to measure ultra-thin, warped, or non-standard wafers with micon or sub-micorn accuracy-and without damaging the sample
Introducing WARP-3500: Advanced Wafer Shape Metrology System
The WARP-3500 by KOVIS Technology is an all-in-oen, high-precision, non-contact wafer thickness and shape measurement solution, it combines dual-sensor architecture, powerful automation, and smart recipe-based mapping
KEY capabilities:
- Non-contact dual sensor (upper/lower) measurement
- Thickness, TTV, bow, warpage, and roughness
- Sub-mircron repeatability (as low as ±0.25 um)
- Automated multi-point mapping( based on user-defined recipes)
- High-resolution R-theta or XYZ linear motor stage
What types of wafers can it measure?
WARP-3500 is designed for difficult shapes, fragile surfaces, and ultra-thin materials.
| Wafer type | Application |
| Back-grinded wafers | Thinned Si |
| Ultra-thin wafers(≤ 20um) | Chip packaging |
| Taiko wafers | Edage-supported types |
| Laminated/tape-mounted wafers | FO-WLP,PLP |
| Bump wafers | WL-CSP, Filp-chip |
| Transparent or reflective wafers | Glass, GaAs, Inp, Sapphire |
The system supprots bare, patterned, bonded, and tapte-mounted wafers, with thickness ranges from 10um to 790um(optionally up to 3,500um with tape)
What makes WARP-3500 stand out?
1.Multi-sensor integration for versatile metrology
choose form an array of precision sensors:
- Confocal laser sensors(CLS)
- Capacitance probes(CPS)
- IR transmission sensors
- WLI roughness sensors
- Air-touch tape thickness sensors
These enable 2D/3D profile imaging, step height measurement, and surface roughness analysis- all in one platform
2.True automation with recipe-driven mapping
- pre-programmed or user-defined e-mapping recipes
- Automatic focus, alignment, and data acquisition
- Output: statistical SPC,charts, CSV exports, real-time 2D/3D visualization
3.Engineer-friendly interface
- one-click measurement start
- Easy point selection form wafer image
- GEM300, SECS/GEM, MES compatible
Technical Highlights
| Feature | Value |
| Thickness Accuracy | ≤ ± 0.5 um |
| Static Repeatability | ≤ ± 0.25 um |
| Dynamic Repeatability | ≤ ± 1 um (9-point, 300mm wafer) |
| Resolution | 0.01 um(10nm) |
| Wafer size | Up to 8 inch (200mm) |
| Stage | R-theta / XYZ motorized stage |
| Software | Windows-based Kovis studio v3.5 |
| Interface | TCP/IP, optional GEM300 |
I am a sales representative at the headquarters of Kovis Technology.
I am committed to providing you with courteous and professional support at all times.
Whether you are looking for the most suitable metrology equipment or need assistance with sample measurements, I am here to help.
Please don’t hesitate to reach out — I would be happy to assist you, even with the smallest inquiries.
You can contact me via the email address on my name tag: Hy.kang@Kovistek.com.
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