Kovis technology

Ultra- Precise Multi-purpose Bond Test System for Semiconductor & ElectronicsPrecision Bond Testing, RedefinedIn today's advanced semiconductor and electronic manufacturing landscape, ensuring reliable mico-bond integrity is no longer optional-it's critical.Introducing the HAWK-8200S,the flagship model of the renowned HAWK series, this ultra-precise bond tester is engineered for high-accuracy sh..

What is RSQ-3000The RSQ-3000 by KOVIS is an advanced sheet resistance (Rs) and resistivity measurement system featuring fully automated mapping capabilities.Equipped with a proven 4-point probe system, it is optimized for accurate, stable measurements on wafers up to 12inches.With intuitive Windows-based GUI software and customizable mapping recipes, even non-experts can operate it with confiden..

Why wafer metrology is now more critical than everIn modern semiconductor manufacturing, wafer thickness, TTV(Total Thickness Variation), and warpage are no longer secondary metrics- they are central to yield, reliability, and packaging compatibility Especially with the rise of:- Thinning & backgrinding- Fan-out wlp (Wafer-Level Packaging)- Advanced pattering with EUVmanufacturers are required t..